Purpose

The purpose of this paper is to investigate the effect of different soldering temperatures on the performance of chip-on-board (COB) light sources during vacuum reflow soldering.

Design/methodology/approach

First, the influence of the void ratio of the COB light source on the steady-state voltage, luminous flux, luminous efficiency and junction temperature has been explored at soldering temperatures of 250°C, 260°C, 270°C, 280°C and 290°C. The COB chip has also been tested for practical application and aging.

Findings

The results show that when the soldering temperature is 270°C, the void ratio of the soldering layer is only 5.1%, the junction temperature of the chip is only 76.52°C, and the luminous flux and luminous efficiency are the highest, and it has been observed that the luminous efficiency and average junction temperature of the chip are 107 lm/W and 72.3°C, respectively, which meets the requirements of street lights. After aging for 1,080 h, the light attenuation is 84.64% of the initial value, which indicates that it has higher reliability and longer life.

Originality/value

It can provide reference data for readers and people in this field and can be directly applied to practical engineering.

中文翻译：

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不同焊接温度对COB光源性能的影响

目的

本文的目的是研究真空回流焊接过程中不同焊接温度对板上芯片 (COB) 光源性能的影响。

设计/方法/方法

首先，在焊接温度250°C、260°C、270°C、280°C下探讨了COB光源的空隙率对稳态电压、光通量、发光效率和结温的影响。和 290°C。COB芯片也经过实际应用和老化测试。

发现

结果表明，焊接温度为270℃时，焊接层的空隙率仅为5.1%，芯片结温仅为76.52℃，光通量和发光效率最高，经观察，该芯片的发光效率和平均结温分别为107 lm/W和72.3°C，满足路灯的要求。老化1080 h后，光衰减为初始值的84.64%，表明其具有更高的可靠性和更长的寿命。

原创性/价值

可为该领域的读者和人员提供参考资料，并可直接应用于实际工程。