In view of the structural warpage deformation and stress-strain problems of 2.5D and 3D package structures under the temperature cycling environment, the causes of structural warpage deformation and the difference of stress and strain between the two structures are analyzed by combining the results of finite element simulations. The most critical solder joints life of the two structures are calculated. The results show that the thermal mismatch of the package structure under temperature cyclic load leads to periodic warping deformation of the structure. The accumulation of CTE mismatch caused significant difference of the warping deformation. The warpage of the 2.5D package structure is much larger than that of the 3D package. Induced by the package layout and structure different, the stress responses to the temperature loading are different between 2.5D package and 3D package are greatly different. The dangerous solder joints of 2.5D/3D package structure are all at the outer edge of the grid. Some high stress also performed at the triple parts interconnections, i.e. the TSV, solder joints and the die. The life prediction was also conducted according to the accumulated plastic strain of dangerous solder joints, which indicated that with the same size and materials of the package design, 2.5D package structure produce more damage to the interconnection and result to a shorter lifetime. An optimization design should be considered to utilize this type of package.

针对2.5D和3D封装结构在温度循环环境下的结构翘曲变形和应力应变问题，结合有限元分析结果，分析了结构翘曲变形的原因以及两种结构之间的应力应变差异。元素模拟。计算两种结构最关键的焊点寿命。结果表明，温度循环载荷下封装结构的热失配导致结构周期性翘曲变形。CTE失配的累积导致翘曲变形的显着差异。2.5D封装结构的翘曲比3D封装的翘曲大很多。由于封装布局和结构不同，2.5D 封装和 3D 封装对温度负载的应力响应不同。2.5D/3D封装结构的危险焊点都在网格外缘。在三部分互连处也产生了一些高应力，即 TSV、焊点和管芯。寿命预测也是根据危险焊点的累积塑性应变进行的，这表明在封装设计的尺寸和材料相同的情况下，2.5D封装结构对互连产生的破坏更大，从而导致寿命更短。应考虑优化设计以使用此类封装。在三部分互连处也产生了一些高应力，即 TSV、焊点和管芯。寿命预测也是根据危险焊点的累积塑性应变进行的，这表明在封装设计的尺寸和材料相同的情况下，2.5D封装结构对互连产生的破坏更大，从而导致寿命更短。应考虑优化设计以使用此类封装。在三部分互连处也产生了一些高应力，即 TSV、焊点和管芯。寿命预测也是根据危险焊点的累积塑性应变进行的，这表明在封装设计的尺寸和材料相同的情况下，2.5D封装结构对互连产生的破坏更大，从而导致寿命更短。应考虑优化设计以使用此类封装。