Flexible memory devices are one of the most crucial elements in the wearable electronics. In this work, polyimides (PIs)-based flexible resistive memory devices with an excellent thermal and mechanical durability are demonstrated. Four kinds of functional PIs are derived from the heterocyclic diamines including 2,6-diaminodibenzo-p-dioxin (OODA) and 2,6-diaminothianthrene, and dianhydrides including 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride. PI with diamine of OODA and dianhydride of 6FDA (PI(OODA_6FDA)) possesses outstanding thermal and mechanical properties with a high glass transition temperature of 352 °C, a low coefficient of thermal expansion of 28.1 ppm K⁻¹, and a high elongation at break of 10%. In addition, PI(OODA_6FDA)-based memory shows write-once-read-many behavior with a high on/off current ratio of 10⁶ and a stable data retention, attributed to the donor–acceptor charge transfer between the polymer chains. The retained current levels at a low resistive state can be observed even with thermal treatment at 200 °C for 24 h or 1000 times cyclic bending at a bending radius of 5 mm. These results demonstrate the potential of heterocyclic PIs for flexible resistive memory.

中文翻译：

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高热稳定性聚酰亚胺在柔性电阻存储器中的应用

柔性存储设备是可穿戴电子产品中最关键的元素之一。在这项工作中，证明了基于聚酰亚胺 (PI) 的柔性电阻存储器件具有出色的热和机械耐久性。四种功能性PI衍生自杂环二胺，包括2,6-二氨基二苯并-对-二恶英（OODA）和2,6-二氨基噻蒽，以及包括4,4'-（六氟异亚丙基）二邻苯二甲酸酐（6FDA）和3的二酐， 3',4,4'-联苯四羧酸二酐。PI 与 OODA 二胺和 6FDA 二酐 (PI(OODA_6FDA)) 具有出色的热和机械性能，玻璃化转变温度高达 352 °C，热膨胀系数低，为 28.1 ppm K ^-1和 10% 的高断裂伸长率。此外，基于 PI(OODA_6FDA) 的存储器显示出一次写入多次读取的行为，具有 10 ⁶的高开/关电流比和稳定的数据保留，这归因于聚合物链之间的供体-受体电荷转移。即使在 200 °C 下热处理 24 小时或以 5 mm 的弯曲半径进行 1000 次循环弯曲，也可以观察到低电阻状态下的保留电流水平。这些结果证明了杂环 PI 在柔性电阻存储器中的潜力。