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Call for papers: Special Issue of the IEEE Transactions on Dielectrics and Electrical Insulation on Electrets and Related Phenomena
IEEE Transactions on Dielectrics and Electrical Insulation ( IF 2.9 ) Pub Date : 2021-08-18 , DOI: 10.1109/tdei.2021.9515842
Xiaoqing Zhang 1 , Peng Fang 2 , Herbert Kliem 3
Affiliation  

We are pleased to announce that the June 2022 issue of the IEEE Transactions on Dielectrics and Electrical Insulation (TDEI) will be a special issue on electrets and related phenomena. This issue is open to all authors. Presenters of papers at the IEEE 18th International Symposium on Electrets (ISE18) to be held during September 24–28, 2021 in Shanghai (China) are especially encouraged to submit their work to this special issue. For more information on ISE18 please go to https://ise18.tongji.edu.cn/.
更新日期:2021-08-18
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