当前位置: X-MOL 学术IEEE Trans. Compon. Packag. Manuf. Technol. › 论文详情
Our official English website, www.x-mol.net, welcomes your feedback! (Note: you will need to create a separate account there.)
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.3 ) Pub Date : 2021-08-18 , DOI: 10.1109/tcpmt.2021.3101098


Presents a listing of the editorial board, board of governors, current staff, committee members, and/or society editors for this issue of the publication.

中文翻译:

IEEE Transactions on Components, Packaging and Manufacturing Technology 出版信息

列出本期出版物的编辑委员会、理事会、现任工作人员、委员会成员和/或学会编辑。
更新日期:2021-08-18
down
wechat
bug