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In Memoriam Prof. Avram Bar-Cohen
IEEE Transactions on Components, Packaging and Manufacturing Technology ( IF 2.3 ) Pub Date : 2021-08-18 , DOI: 10.1109/tcpmt.2021.3101276
Marc S. Hodes , Madhusudan Iyengar , Mehmet Arik , Kyoung Joon Kim , Mark Spector , Sushil H. Bhavnani , Yogendra K. Joshi , Ravi V. Mahajan , Koneru Ramakrishna

The outpouring of emotion and appreciation for Prof. Avram (Avi) Bar-Cohen from his students and colleagues in the academic, industrial, and government communities in Heat Transfer and Electronics Packaging is a testament to the truly profound impact that he had on our professional and personal lives. Awards are being renamed in his honor, tributes are pouring in [1], special issues of the IEEE Transactions on Components, Packaging, and Manufacturing Technology (TCPMT) and the ASME Journal of Electronic Packaging are appearing, and articles have been crafted to honor his legacy [2], [3].

中文翻译:


悼念 Avram Bar-Cohen 教授



Avram (Avi) Bar-Cohen 教授在传热和电子封装领域的学术界、工业界和政府界的学生和同事对他倾注了情感和赞赏,这证明了他对我们的专业产生了真正深远的影响。和个人生活。为了纪念他,奖项被重新命名,悼念之情纷至沓来 [1],《IEEE 组件、封装和制造技术汇刊》(TCPMT) 和《ASME 电子封装杂志》的特刊不断出现,并撰写了一些文章来纪念他他的遗产[2],[3]。
更新日期:2021-08-18
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