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Selective Laser Melting of Cu–10Sn–0.4P: Processing, Microstructure, Properties, and Brief Comparison with Additively Manufactured Cu–10Sn
Advanced Engineering Materials ( IF 3.4 ) Pub Date : 2021-08-18 , DOI: 10.1002/adem.202100716
Ruinan Gu 1, 2 , Xiyu Yao 2 , Dawei Wang 2 , Hui Wang 3 , Ming Yan 2 , Kam Sing Wong 1
Affiliation  

Selective laser melting is an additive manufacturing technique that can be used to achieve excellent forming of Cu alloys. Specifically, high-Sn–Cu alloys (e.g., Cu–10Sn) offer good wear and corrosion resistance, and are extensively used in industrial applications. Although P is considered a beneficial element in Cu–Sn alloys, particularly with respect to ductility, P-doped Cu–10Sn alloy (Cu–10Sn–0.4P) has not yet been investigated in detail. Thus, herein, it provides valuable insights regarding the printability, residual stress level, heat treatment conditions, mechanical properties, and microstructural features of selective laser melted Cu–10Sn–0.4P. The alloy is successfully printed using a relatively wide range of processing parameters. The high levels of residual stress after printing were relieved using heat treatment under appropriate conditions. Consequently, a good combination of strength, ductility, and hardness was achieved. The addition of P led to an improved oxygen scavenging capability, thus Cu–10Sn–0.4P alloy exhibited a better ductility than P-free Cu–Sn alloy. The excellent printability of Cu–10Sn–0.4P is demonstrated by printing a variety of objects, including flanges, sheathings, and jewelry rings.

中文翻译:

Cu-10Sn-0.4P 的选择性激光熔化:加工、显微组织、性能以及与增材制造的 Cu-10Sn 的简要比较

选择性激光熔化是一种增材制造技术,可用于实现铜合金的出色成型。具体而言,高 Sn-Cu 合金(例如,Cu-10Sn)具有良好的耐磨性和耐腐蚀性,并广泛用于工业应用中。尽管 P 被认为是 Cu-Sn 合金中的有益元素,特别是在延展性方面,但尚未详细研究 P 掺杂的 Cu-10Sn 合金 (Cu-10Sn-0.4P)。因此,在这里,它提供了关于选择性激光熔化的 Cu-10Sn-0.4P 的可印刷性、残余应力水平、热处理条件、机械性能和微观结构特征的有价值的见解。该合金使用相对广泛的加工参数成功印刷。印刷后的高水平残余应力通过在适当条件下进行热处理得到缓解。因此,实现了强度、延展性和硬度的良好组合。P 的添加提高了除氧能力,因此 Cu-10Sn-0.4P 合金比无 P 的 Cu-Sn 合金表现出更好的延展性。Cu-10Sn-0.4P 的出色可印刷性通过印刷各种物体(包括法兰、护套和珠宝戒指)得到证明。
更新日期:2021-08-18
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