Purpose

In this paper, a lifetime estimation model for the solder joint is proposed which is capable of considering both severe and running mechanical shocks which is the real case in electric converters in the automotive and aerospace applications. This paper aims to asses the reliability of the solder joint under mixed exposure of mechanical loads.

Design/methodology/approach

Mechanical failure process may put at risk the perfect performance of any kinds of electronic systems regardless of the applications they are prepared for. Observation of solder joint health in an electronic assembly under simultaneous exposure of severe and running shocks is an open problem. Three commonly used soldering compositions are considered while the electronic assembly is exposed to three well-known driving cycles.

Findings

The results show that the best performance is achieved using SAC405 soldering alloy in comparison with Sn63Pb37 and SAC387 solder alloy. Consideration of mixed exposure to the mechanical loads leads to much more accurate lifetime estimation of the solder joint in the electronic assemblies.

Originality/value

The originality of the paper is confirmed.

中文翻译：

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机械载荷混合作用下电子组件焊点的可靠性建模和评估

目的

在本文中，提出了一种焊点寿命估计模型，该模型能够同时考虑严重和运行的机械冲击，这是汽车和航空航天应用中电气转换器的真实情况。本文旨在评估在机械负载混合暴露下焊点的可靠性。

设计/方法/方法

机械故障过程可能会危及任何类型的电子系统的完美性能，无论它们准备用于何种应用。在同时暴露于严重冲击和运行冲击的情况下，观察电子组件中焊点的健康状况是一个悬而未决的问题。当电子组件暴露于三个众所周知的驱动循环时，考虑了三种常用的焊接组合物。

发现

结果表明，与 Sn63Pb37 和 SAC387 焊料合金相比，使用 SAC405 焊料合金获得了最佳性能。对机械负载的混合暴露的考虑导致对电子组件中焊点的更准确的寿命估计。

原创性/价值

论文的原创性得到证实。