2,7-Diphenyloxynaphthalene with large conjugated structure has been introduced into the main chain of silicon-containing arylacetylene resin and then poly(dimethylsilylene-ethynylenephenoxynaphthyloxyphenylene-ethynylene) (m-PPNSA-MM) was synthesized. The m-PPNSA-MM resin shows good solubility and a wide processing window. A stable three-dimensional cross-linking network formed due to thermal crosslinking reactions of acetylene groups and intermolecular π–π stacking interactions after m-PPNSA-MM was cured through the process of 180°C/2 h + 220°C/2 h + 260°C/4 h. The flexural strength and modulus of the cured m-PPNSA-MM resin at room temperature are 49.2 MPa and 2.75 GPa, respectively. The cured m-PPNSA-MM resin show high thermal stabilities, the 5% temperature of weight loss (T_d5) reaches 560°C in nitrogen.

将具有大共轭结构的2,7-二苯氧基萘引入含硅芳乙炔树脂的主链，合成了聚(二甲基亚甲硅烷-乙炔苯氧基萘氧基亚苯基-乙炔)( m -PPNSA-MM)。所述米-PPNSA-MM树脂显示出良好的溶解性和宽的加工窗口。m -PPNSA-MM经过180°C/2 h + 220°C/2 h固化后，乙炔基团的热交联反应和分子间π-π堆积相互作用形成了稳定的三维交联网络+ 260°C/4 小时。固化后的m -PPNSA-MM 树脂在室温下的弯曲强度和模量分别为 49.2 MPa 和 2.75 GPa。治愈的米-PPNSA-MM树脂表现出很高的热稳定性，5%的失重温度（T _d5）在氮气中达到560°C。