I have been developing MEMS (microelectromechanical systems) technology and supporting the industry through collaboration. A facility was built in house on a 20 mm square wafer for use in prototyping MEMS and ICs (integrated circuits). The constructed MEMS devices include commercialized integrated capacitive pressure sensors, electrostatically levitated rotational gyroscopes, and two-axis optical scanners. Heterogeneous integration, which is a MEMS on an LSI (large-scale integration), was developed for sophisticated systems using LSI made in a foundry. This technology was applied for tactile sensor networks for safe robots, multi FBAR filters on LSI, active-matrix multielectron emitter arrays, and so on. The facility used to produce MEMS on 4- and 6-inch wafers was developed based on an old semiconductor factory and has been used as an open hands-on access facility by many companies. Future directions of MEMS research are discussed.

我一直在开发 MEMS（微机电系统）技术并通过合作为行业提供支持。在 20 平方毫米的晶圆上建造了一个工厂，用于 MEMS 和 IC（集成电路）的原型制作。构建的 MEMS 设备包括商业化的集成电容压力传感器、静电悬浮旋转陀螺仪和两轴光学扫描仪。异构集成是 LSI（大规模集成）上的 MEMS，是为使用代工厂制造的 LSI 的复杂系统开发的。该技术应用于安全机器人的触觉传感器网络、LSI 上的多 FBAR 滤波器、有源矩阵多电子发射器阵列等。用于在 4 英寸和 6 英寸晶圆上生产 MEMS 的设施是基于旧的半导体工厂开发的，并已被许多公司用作开放式动手访问设施。讨论了 MEMS 研究的未来方向。