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Preparation and Properties of Electrospun Polyimide Ultrafine Fibrous Mats with Excellent Heat-fusibility via Hot-press procedure from Organo-soluble Polyimides Containing Phenolphthalein Units
Fibers and Polymers ( IF 2.2 ) Pub Date : 2021-08-10 , DOI: 10.1007/s12221-021-0091-1
Hao-ran Qi 1 , Yan Zhang 1 , Xin-xin Zhi 1 , Lin Qi 1 , Hao Wu 1 , Xin-ying Wei 1 , Jin-gang Liu 1
Affiliation  

Electrospun polyimide (PI) ultrafine non-woven fibrous mats (UFMs) with good heat-fusibility via hot press procedure were successfully fabricated. For this purpose, two organo-soluble PI resins were prepared via a two-step chemical imidization procedure from two isomeric oxydiphthalic dianhydrides, including the asymmetrical ODPA (2,3,3′,4′-oxydiphthalic dianhydride, or aODPA) and symmetrical ODPA (4,4′-oxydiphthalic dianhydride, or ODPA) with an aromatic diamine containing phenolphthalein unit in the main chain, 3,3-bis[4-(4-aminophenoxy)phenyl]phthalide (BAPPT), respectively. The derived PI-1 (aODPA-BAPPT) and PI-2 (ODPA-BAPPT) resins showed high numerical average molecular weights (Mn) over 105 g/mol and were easily soluble in polar aprotic solvents, such as N-methyl-2-pyrrolidinone (NMP) and N, N-dimethylacetamide (DMAc). PI-1 and PI-2 UFMs were successfully prepared from the PI solutions in DMAc via the one-step electrospinning procedure. Different rotating speeds of 500–2500 round per minute (rpm) for the cylindrical collector were set to investigate the effects of the fiber morphologies on the properties of the PI UFMs. The derived PI UFMs showed good thermal stability with the glass transition temperatures (Tg) over 280 °C and 5 % weight loss temperatures (T5%) higher than 510 °C in nitrogen. The PI UFMs could be successfully heat-sealed via the hot-press temperature at 320 °C (about 40 °C higher than Tg) for 60s with the pressure of 0.5 MPa.



中文翻译:

含酚酞单元的有机可溶性聚酰亚胺通过热压法制备具有优异热熔性的电纺聚酰亚胺超细纤维垫及其性能

成功地通过热压工艺制备了具有良好热熔性的电纺聚酰亚胺 (PI) 超细无纺纤维垫 (UFM)。为此,通过两步化学酰亚胺化程序从两种异构的氧二邻苯二甲酸二酐制备了两种有机可溶性 PI 树脂,包括不对称 ODPA(2,3,3',4'-氧二邻苯二甲酸二酐,或 aODPA)和对称 ODPA (4,4'-氧二邻苯二甲酸二酐,或 ODPA) 在主链中分别具有含酚酞单元的芳族二胺,分别为 3,3-双[4-(4-氨基苯氧基)苯基]苯酞 (BAPPT)。衍生的 PI-1 (aODPA-BAPPT) 和 PI-2 (ODPA-BAPPT) 树脂显示出超过 10 5 g/mol 的高数均分子量 ( M n ),并且很容易溶于极性非质子溶剂,例如N-甲基-2-吡咯烷酮(NMP)和N,N-二甲基乙酰胺(DMAc)。PI-1 和 PI-2 UFM 是通过一步静电纺丝程序从 DMAc 中的 PI 溶液成功制备的。为圆柱形收集器设置 500-2500 转每分钟 (rpm) 的不同转速,以研究纤维形态对 PI UFM 性能的影响。衍生的 PI UFM 显示出良好的热稳定性,玻璃化转变温度 ( T g ) 超过 280 °C,5% 重量损失温度 ( T 5% ) 在氮气中高于 510 °C。所述PI UFMS可成功通过热压温度在320℃(热密封约40℃高于Ť) 60 秒,压力为 0.5 兆帕。

更新日期:2021-08-10
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