Purpose

This study aims to numerically investigate the thermal-hydrodynamic performance of silicon oxide/water nanofluid laminar flow in the heat sink miniature channel with different fin cross-sections. The effect of the fin cross-section including semi-circular, rectangular and quadrant in two directions of flat and curved, and channel substrate materials of steel, aluminum, copper and titanium were examined. Finally, the analysis of thermal and frictional entropy generation in different channels is performed.

Design/methodology/approach

According to the numerical results, the highest heat transfer coefficients belong to the rectangular, quadrant 2, quadrant 1 and semi-circular fins compared to the channel without fin is 38.65%, 29.94%, 27.45% and 17.1%, respectively. Also, the highest performance evaluation criteria belong to the rectangular and quadrant 2 fins, which have 1.35 and 1.29, respectively. Based on the thermal conductivity of the substrate material, the best material is copper. According to the results of entropy analysis, the reduction of thermal irreversibility of the channel with rectangular, quadrant 1, quadrant 2 and semi-circular compared to non-finned channel is equal to 72%, 57%, 63% and 48%, respectively.

Findings

The rectangular and quadrant 2 fins are the best fins and the copper substrate material is the best material to reduce the entropy generation.

Originality/value

The silicon oxide/water nanofluid flow in the heat sink miniature channel with various fin shapes and the curvature angle against the fluid flow was simulated to increase the heat transfer performance. The whole test section is simulated in three-dimensional. Different channel materials have been investigated to find the best channel substrate material.

中文翻译：

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不同翅片截面通道中纳米流体熵产生及强制对流换热的数值研究

目的

本研究旨在数值研究氧化硅/水纳米流体层流在具有不同翅片横截面的散热器微型通道中的热流体力学性能。研究了半圆形、矩形和象限形的翅片横截面在平面和弯曲两个方向上的影响，以及钢、铝、铜和钛的通道基板材料。最后，对不同通道中的热和摩擦熵生成进行了分析。

设计/方法/方法

根据数值结果，矩形、2象限、1象限和半圆形翅片的传热系数最高，与无翅片通道相比，分别为38.65%、29.94%、27.45%和17.1%。此外，最高性能评估标准属于矩形和象限 2 翅片，分别为 1.35 和 1.29。根据基板材料的导热性，最好的材料是铜。根据熵分析结果，矩形、1象限、2象限和半圆形通道与无翅片通道相比，热不可逆性降低分别为72%、57%、63%和48% .

发现

矩形和象限2翅片是最好的翅片，铜基板材料是减少熵产生的最好材料。

原创性/价值

模拟了具有各种翅片形状的散热器微型通道中的氧化硅/水纳米流体流动以及与流体流动的曲率角，以提高传热性能。整个测试部分是在三维中模拟的。已经研究了不同的通道材料以找到最佳的通道基板材料。