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Numerical investigation of bimaterial interfacial crack with interaction of voids and inclusions using XFEM
Mechanics Based Design of Structures and Machines ( IF 2.9 ) Pub Date : 2021-08-09 , DOI: 10.1080/15397734.2021.1956326
Achchhe Lal 1 , M. B. Vaghela 1
Affiliation  

Abstract

This article is presented to investigate the influence of several discontinuity like interfacial-crack, void and inclusion in the bimaterial plate, to analyze the normalized mixed-mode stress intensity factor (NMMSIFs) using XFEM under the uniaxial tensile load with considering the several numerical problems. It is investigated the normalized stress intensity factors (NSIFs) for an isotropic bimaterial plate and NMMSIFs for an isotropic-orthotropic bimaterial plate through varying the single-multi voids/inclusions position while its above, aligned and away from the interfacial edge crack and center crack of the bimaterial plate. It is also analyzed the void/inclusion several shape influence in the bimaterial plate. It is observed higher and fluctuating SIFs obtained with more number of voids/inclusions, influence of elliptical and diamond shape of void/inclusion is higher.



中文翻译:

使用 XFEM 对具有空隙和夹杂物相互作用的双材料界面裂纹进行数值研究

摘要

本文旨在研究双材料板中界面裂纹、空隙和夹杂物等几种不连续性的影响,并考虑几个数值问题,使用 XFEM 在单轴拉伸载荷下分析归一化混合模式应力强度因子 (NMMSIF) 。研究了各向同性双材料板的归一化应力强度因子(NSIF)和各向同性-正交各向异性双材料板的 NMMSIF,通过改变单多空隙/夹杂物位置,同时其上方、对齐并远离界面边缘裂纹和中心裂纹双材料板的。还分析了双材料板中空隙/夹杂物几种形状的影响。观察到随着更多数量的空隙/夹杂物获得更高且波动的 SIF,

更新日期:2021-08-09
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