A three-stage amplifier with hybrid active Miller enhancement compensation is proposed in this paper, which is used for large to heavy load applications. The hybrid active Miller enhancement compensation (HAMEC) is composed of an amplified cascode Miller capacitor block and a local active compensation network. The sub-threshold transconductance enhanced compensation (STEC) amplifying block consists of a sub-threshold amplifier and a cascode capacitor, which effectively broadens the complex-poles frequency and improves the loop stability. A novel slew rate enhancement structure is also proposed to improve the transient response under large signal conditions. The amplifier has been verified in a 0.18 μm CMOS process. After simulation verification, the capacitive loads of 0.5pF-20nF can be driven, meanwhile, a gain bandwidth of 2.98–9.76 MHz can be achieved. It only consumes 41.28 μW power when driving a 20 nF capacitor load under 1.2 V power supply, and compensation capacitor size is only 475 fF. Finally, the figure of merits (FoM) value is effectively improved compared with recent work.

本文提出了一种具有混合有源米勒增强补偿的三级放大器，用于大到重负载的应用。混合有源米勒增强补偿 (HAMEC) 由放大的共源共栅米勒电容器块和本地有源补偿网络组成。亚阈值跨导增强补偿（STEC）放大模块由亚阈值放大器和共源共栅电容组成，有效拓宽复极点频率，提高环路稳定性。还提出了一种新颖的压摆率增强结构，以改善大信号条件下的瞬态响应。该放大器已通过 0.18 μm CMOS 工艺验证。经过仿真验证，可以驱动0.5pF-20nF的容性负载，同时增益带宽为2.98-9。可以达到 76 MHz。在 1.2 V 电源下驱动 20 nF 电容负载时仅消耗 41.28 μW 功率，补偿电容尺寸仅为 475 fF。最后，与最近的工作相比，品质因数 (FoM) 值得到了有效改善。