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Novel Approach for Using Ductile Iron as Substrate in Bimetallic Materials for Higher Interfacial Bonding Bearings
International Journal of Metalcasting ( IF 2.6 ) Pub Date : 2021-08-07 , DOI: 10.1007/s40962-021-00653-0
Mohamed Ramadan 1, 2 , Abdulaziz S. Alghamdi 1 , B. Ayadi 1 , K. S. Abdel Halim 1, 2 , K. M. Hafez 2
Affiliation  

The Sn-based Babbitt and ductile iron bimetallic composites were fabricated by liquid–solid compound casting process. The Sn-based Babbitt alloy was melted in an electrical furnace and then poured into a mould containing ductile iron solid substrate. Different pre-treatment conditions for ductile iron surface using grinding, polishing and normalizing heat treatment were applied before tinning process for the aim of surface graphite decarburization. Such kind of approach can be considered as a promising way allowing using ductile iron as a substrate in the manufacturing of bimetallic materials. The results of the experiments show that only 40% of interfacial bonding area was achieved by the grinding and polishing (for 10 min) of ductile iron substrate, whereas, by the normalizing heat treatment of ductile iron substrate at 850 °C for 25 min (along with grinding and polishing), an increasing of the interfacial bonding area of 85% was achieved. All these variations can be attributed to the relatively higher percentage of surface graphite decarburization under controlled conditions of heat treatment and substrate preparation. The test of shear stress value of the bimetal with normalized ductile iron substrate is significantly higher (9.5 ± 0.48 MPa) than that of bimetal with grinded–polished ductile iron substrate (5.5 ± 0.28). Furthermore, Babbitt/ductile iron bimetallic specimens fabricated under these certain conditions of grinding and normalizing demonstrates a relatively higher interfacial hardness level (42 ± 2.1 HV). It can be reported that the lower value of free carbon in bimetal interface of normalized ductile iron substrate improves the interfacial bonding area and the elements diffusion and consequently, leads to increasing the microhardness.



中文翻译:

在高界面结合轴承双金属材料中使用球墨铸铁作为基材的新方法

Sn基巴氏合金和球墨铸铁双金属复合材料采用液固复合铸造工艺制备。将锡基巴氏合金在电炉中熔化,然后倒入含有球墨铸铁固体基体的模具中。以表面石墨脱碳为目的,在镀锡前采用磨削、抛光、正火热处理等不同的球墨铸铁表面预处理条件。这种方法可以被认为是一种有前途的方法,允许在双金属材料的制造中使用球墨铸铁作为基材。实验结果表明,球墨铸铁基体的研磨和抛光(10 min)仅实现了40%的界面结合面积,而,通过对球墨铸铁基体在 850°C 下正火热处理 25 分钟(同时进行研磨和抛光),界面结合面积增加了 85%。所有这些变化都可以归因于在热处理和基材制备的受控条件下表面石墨脱碳的百分比相对较高。正火球墨铸铁基体双金属的剪切应力测试值(9.5±0.48 MPa)明显高于研磨抛光球墨铸铁基体的双金属(5.5±0.28)。此外,在这些特定的研磨和正火条件下制造的巴氏合金/球墨铸铁双金属试样显示出相对较高的界面硬度水平 (42 ± 2.1 HV)。

更新日期:2021-08-10
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