Conductive copper paste is a promising material for use in electronic devices, replacing silver or other metal pastes, because of its high conductivity, low electro-migration, and cost. However, the high sintering temperature and the need of an inert sintering atmosphere limit the commercial application of copper paste. In this study, a copper thick film paste for use on alumina was developed using a mixture of copper nanoparticles (50 nm in size) and microparticles (1 μm in size). With this paste, the sintering temperature was as low as 500 °C when the pressure was at ambient pressure. It was found that the bimodal copper film offered the best volume resistivity of 6.26 × 10⁻⁸ Ω·m at a weight ratio of micro- to nanoparticles of 2:1. Glass frits were used as an additive to improve the adhesion strength between the copper film and the alumina substrate with minimal change in electrical performance.

导电铜浆是一种很有前途的材料，可用于电子设备，替代银或其他金属浆，因为它具有高导电性、低电迁移和成本。然而，高烧结温度和惰性烧结​​气氛的需要限制了铜浆的商业应用。在这项研究中，使用铜纳米颗粒（尺寸为 50 nm）和微粒（尺寸为 1 μm）的混合物开发了一种用于氧化铝的铜厚膜浆料。当压力为环境压力时，使用这种浆料，烧结温度低至 500 °C。发现双峰铜膜提供了最好的体积电阻率 6.26 × 10 ^-8Ω·m，微米与纳米粒子的重量比为 2:1。玻璃料用作添加剂以提高铜膜和氧化铝基板之间的粘合强度，同时电气性能的变化最小。