Abstract

The analysis of methods for calculating the components of thermal conductivity of solid materials is carried out. The problems of using these methods are identified and their assessment is given from the point of view of obtaining reliable results. Experimental data on the temperature dependences of thermoelectric parameters of the main thermoelectric materials (TEMs) used for the manufacturing of Peltier and Seebeck thermoelements are presented. Using the obtained data, we calculated the main components of the thermal conductivity of TEMs (phonon, electronic, and bipolar) in the temperature range from 250 to 1200 K for solid solutions based on Bi, Sb, Pb, and Ge chalcogenides, as well as SiGe obtained by various methods of directional crystallization. The relationship between the mechanisms of heat transfer in TEMs and the temperature dependences of electrical conductivity and thermoelectric power has been established. It is shown that the use of nanostructured TEMs is promising for increasing the thermoelectric figure of merit.

中文翻译：

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热电材料中的传热机制

摘要

对固体材料热导率分量的计算方法进行了分析。确定了使用这些方法的问题，并从获得可靠结果的角度对其进行了评估。提供了用于制造珀耳帖和塞贝克热电元件的主要热电材料 (TEM) 的热电参数的温度依赖性的实验数据。使用获得的数据，我们计算了基于 Bi、Sb、Pb 和 Ge 硫属化物的固溶体在 250 到 1200 K 温度范围内 TEM（声子、电子和双极）的热导率的主要成分，以及作为通过各种定向结晶方法获得的 SiGe。TEM 中的传热机制与电导率和热电功率的温度依赖性之间的关系已经建立。结果表明，使用纳米结构的 TEM 有望提高热电品质因数。