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Guest Editorial Special Section on the IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS)
IEEE Transactions on Semiconductor Manufacturing ( IF 2.3 ) Pub Date : 2021-08-04 , DOI: 10.1109/tsm.2021.3097818
Carlo Cagli , Stewart Smith

This special section of IEEE Transactions on Semiconductor Manufacturing presents extended versions of papers originally presented as part of the IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS) which was hosted at the University of Edinburgh, Scotland. Originally planned to take place at the University’s South Hall Complex in April 2020, the impact of the global pandemic led to the difficult decision to move to a fully virtual conference held between 4th – 18th May 2020. The guest editors for this special section, who were honoured to act as the General Chair and Technical Chair of the conference, would like to thank all of those involved in making the virtual conference a success, not least the digital events team from the IEEE who made it possible.

中文翻译:


IEEE 第 33 届微电子测试结构国际会议 (ICMTS) 客座编辑专题



IEEE Transactions on Semiconductor Manufacturing 的这一特殊部分介绍了最初作为在苏格兰爱丁堡大学主办的 IEEE 第 33 届微电子测试结构国际会议 (ICMTS) 的一部分提出的论文的扩展版本。原计划于 2020 年 4 月在大学南厅综合楼举行,但由于全球大流行的影响,我们做出了艰难的决定,改为在 2020 年 5 月 4 日至 18 日之间举行完全虚拟的会议。本特别部分的客座编辑,我们很荣幸担任会议的总主席和技术主席,感谢所有参与使虚拟会议取得成功的人员,尤其是 IEEE 的数字活动团队,他们使会议成为可能。
更新日期:2021-08-04
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