Frequency response to stimuli applied to acoustic micro-electro-Mechanical Systems (MEMS) yield meaningful information of certain defects affecting such devices. This article presents the effects of three distinct root causes of failures affecting the low-frequency response of MEMS microphones: lid attach holes, die attach holes and broken vents with experimental inductions of these effects for the lid attach holes and broken vents. Methods to create such defects are presented which include laser drilling and focused ion beam machining of holes. A complete characterization of induced broken vents is presented. Alternative locations for defects induction are proposed and demonstrated on 34 devices, 16 with lid attach holes and 18 with induced broken vents. The information obtained from the frequency response of the devices is shown to be insufficient to separate the root causes of failures as their effects on the frequency response is similar and the magnitudes of the variations of the observed response overlap. Additional information about the circumstances regarding the onset of defects such as location of the fault and its occurrence in the device manufacturing/assembly/operation timeline is however sufficient for root cause identification.

中文翻译：

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用于确定故障模式的声学 MEMS 的低频响应研究

对应用于声学微机电系统 (MEMS) 的刺激的频率响应会产生影响此类设备的某些缺陷的有意义的信息。本文介绍了影响 MEMS 麦克风低频响应的三个不同的故障根本原因的影响：盖子连接孔、芯片连接孔和破裂的通风口，并通过实验归纳了这些影响对盖子连接孔和破裂的通风口的影响。提出了产生这种缺陷的方法，包括激光钻孔和孔的聚焦离子束加工。介绍了诱导破裂通风口的完整特征。在 34 个设备上提出并演示了缺陷诱导的替代位置，其中 16 个带有盖子连接孔，18 个带有诱导破裂的通风口。从设备的频率响应中获得的信息不足以区分故障的根本原因，因为它们对频率响应的影响是相似的，并且观察到的响应变化的幅度重叠。然而，关于缺陷发生情况的附加信息（例如故障位置及其在设备制造/组装/操作时间表中的发生）足以识别根本原因。