Purpose

Recent advancements in the domain of smart communication systems and technologies have led to the augmented developments for very large scale integrated circuit designs in electro-magnetic applications. Increasing demands for low power, compact area and superior figure of merit–oriented circuit designs are the trends of the recent research studies. Hence, to accomplish such applications intended for optical communications, the transimpedance amplifier (TIA) was designed.

Design/methodology/approach

In this research work, the authors present a multi-layer active feedback structure which mainly composes a transimpedance stage and a gain stage followed by a low pass filter. This structure enables to achieve improved input impedance and superior gain. A simplified cascaded amplifier has also been designed in a hierarchical topology to improvise the noise effect further. The proposed TIA has been designed using Taiwan Semiconductor Manufacturing Company 45 nm complementary metal oxide semiconductor technology. Moreover, the thermal noise has been analyzed at −3 dB bandwidth to prove the reduction in thermal noise with increase in frequency for most of the devices used in the designed circuit.

Findings

The proposed differential TIA circuit was found to obtain the transimpedance gain of 50.1 dBO without applying any external bias current which is almost 8% improvised as compared to the conventional circuit. In addition to this, bandwidth achieved was 2.15 GHz along with only 38 W of power consumption, which is reasonably 100 times improvised in comparison of conventional circuit. Hence, the proposed differential TIA is suitable for the low power optical communications applications intended to work on low supply voltage.

Originality/value

The designed work is done by authors in university lab premises and is not copied from anywhere. To the best of the authors’ knowledge, it is 100% original.

中文翻译：

---

用于光接收器的 45 nm CMOS 低功耗多级有源反馈跨阻放大器

目的

智能通信系统和技术领域的最新进展导致了电磁应用中超大规模集成电路设计的增强发展。对低功耗、紧凑面积和卓越品质因数导向电路设计的需求不断增加是最近研究的趋势。因此，为了实现用于光通信的此类应用，设计了跨阻放大器 (TIA)。

设计/方法/途径

在这项研究工作中，作者提出了一种多层有源反馈结构，该结构主要由跨阻级和增益级组成，后接低通滤波器。这种结构能够实现改进的输入阻抗和卓越的增益。还在分层拓扑中设计了一个简化的级联放大器，以进一步改进噪声效应。拟议的 TIA 是使用台积电 45 纳米互补金属氧化物半导体技术设计的。此外，已在 −3 dB 带宽下分析热噪声，以证明设计电路中使用的大多数器件的热噪声会随着频率的增加而降低。

发现

发现所提出的差分 TIA 电路无需施加任何外部偏置电流即可获得 50.1 dBO 的互阻增益，与传统电路相比，该增益几乎提高了 8%。除此之外，实现的带宽为 2.15 GHz，功耗仅为 38 W，与传统电路相比，合理提高了 100 倍。因此，所提出的差分 TIA 适用于旨在在低电源电压下工作的低功率光通信应用。

原创性/价值

设计作品由作者在大学实验室完成，不会从任何地方复制。据作者所知，它是 100% 原创的。