We present a systematic study of micro-trench resonators for heterogeneous integration with silicon waveguides. We experimentally and numerically demonstrate that the approach is compatible with a large variety of thin film materials and that it does not require specific etching recipe development, thus making it virtually universal. The microresonators are fabricated through in-foundry silicon-on-insulator processing and in-house backend processing. We also report ultra-compact chalcogenide microresonators with radius as small as 5µ and quality factors up to 1.8 × 10⁵. We finally show a proof-of-concept of a novel multilayer waveguide using the micro-trench technique.

中文翻译：

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用于与硅波导单片集成的通用微沟槽谐振器

我们对用于与硅波导异质集成的微沟槽谐振器进行了系统研究。我们通过实验和数值证明该方法与多种薄膜材料兼容，并且不需要开发特定的蚀刻配方，因此几乎可以通用。微谐振器是通过代工厂内的绝缘体上硅加工和内部后端加工制造的。我们还报告了半径小至 5μ 且品质因数高达 1.8 × 10 ^{5 的}超紧凑型硫属化物微谐振器。我们最终展示了使用微沟槽技术的新型多层波导的概念验证。