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Dissipating the heat generated in high-performance electronics using graphitic foam heat-sinks cooled with a dielectric liquid
International Communications in Heat and Mass Transfer ( IF 6.4 ) Pub Date : 2021-07-30 , DOI: 10.1016/j.icheatmasstransfer.2021.105478
Ahmed Alhusseny 1, 2 , Ali Al-Fatlawi 1 , Qahtan Al-Aabidy 1 , Adel Nasser 2 , Nabeel Al-Zurfi 1, 2
Affiliation  

Due to their unique heat transfer features, graphitic foams have been used in the current analysis to form heat sinks effective enough to dissipate extreme heat generated within high-performance electronics. The heat sinks suggested are formed from foamed-baffles arranged in-parallel or perpendicularly to the coolant paths via the staggered voids in between to alleviate the penalty of pressure drop while maintaining high heat dissipation capability. Dielectric liquid, developed for direct electronics cooling, has been utilised as a coolant to sweep away the too high heat density generated within high-performance electronics. The feasibility of the currently suggested thermal management technique has been numerically inspected following the volume-averaging approach of porous media considering a local thermal non-equilibrium to prevail between the solid foam and liquid coolant flowing through. Based on the SIMPLE algorithm, the iterative solution has been implemented using the STAR-CCM+ CFD commercial code for a wide range of operating and design conditions. The design parameters tested are the height of foam baffles and how they are orientated towards the mainstream besides the structural specifications of the graphitic foam employed, while the operating conditions examined are the coolant flowrate along with the heat density applied. It has been found that the heat sinks proposed is effective enough to fulfil the extreme thermal requirements in high performance electronics and capable to dissipate the heat generated there with affordable pressure losses, where proper selection of design parameters in light of the operating conditions applied can prevent the emergence of hot spots entirely.



中文翻译:

使用由介电液体冷却的石墨泡沫散热器消散高性能电子产品中产生的热量

由于其独特的传热特性,石墨泡沫已被用于当前的分析中,以形成足够有效的散热器,以消散高性能电子设备中产生的极端热量。建议的散热器由泡沫挡板形成,泡沫挡板通过中间的交错空隙与冷却剂路径平行或垂直排列,以减轻压降的损失,同时保持高散热能力。为直接电子冷却而开发的介电液体已被用作冷却剂,以清除高性能电子设备中产生的过高热密度。目前建议的热管理技术的可行性已经按照多孔介质的体积平均方法进行了数值检验,考虑到固体泡沫和液体冷却剂之间流动的局部热非平衡占优势。基于 SIMPLE 算法,迭代解决方案已使用 STAR-CCM+ CFD 商业代码实现,适用于各种操作和设计条件。除了所采用的石墨泡沫的结构规格外,测试的设计参数是泡沫挡板的高度以及它们如何朝向主流定向,而检查的操作条件是冷却剂流量以及应用的热密度。

更新日期:2021-08-01
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