Cracking of slabs and fracturing of continuous stepped nanostructures were investigated by varying the cutting parameters during the nanoskiving process. The slabs containing continuous stepped nanostructures were obtained under various nanoskiving cutting angles (0°–90°, stepped in units of 5°). The slab cracking and the nanostructure morphology were observed using atomic force microscopy. The pitched line height was greater than that of the straight lines in this nanostructure, and the integrity of structures obtained at a 55° cutting angle was superior to that of 0° and 90°. The cracking of slabs during the cutting process was mitigated by changing the cutting depth or knife tool material. Comparing electrical properties of nanostructures under two coating methods (electron -beam evaporation and magnetron sputtering), sputtering has a lower resistivity because of its larger grain size and tightness of distribution. All defects could be explained by analyzing the cutting force used during the cutting and trimming processes, whereby optimization schemes for fracture and crack prevention were obtained.

通过在纳米刮削过程中改变切割参数来研究板坯的开裂和连续阶梯纳米结构的断裂。在各种纳米切削角度（0°–90°，以5°为单位步进）下获得包含连续阶梯状纳米结构的板坯。使用原子力显微镜观察板坯开裂和纳米结构形态。该纳米结构中的节距线高度大于直线高度，55°切割角获得的结构完整性优于0°和90°。通过改变切割深度或刀具材料，减轻了切割过程中板坯的开裂。比较两种涂层方法（电子束蒸发和磁控溅射）下纳米结构的电性能，由于其较大的晶粒尺寸和分布的紧密性，溅射具有较低的电阻率。所有缺陷都可以通过分析切割和修整过程中使用的切削力来解释，从而获得断裂和裂纹预防的优化方案。