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Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints
Soldering & Surface Mount Technology ( IF 1.7 ) Pub Date : 2021-07-28 , DOI: 10.1108/ssmt-02-2021-0006
Mardiana Said 1 , Muhammad Firdaus Mohd Nazeri 2 , Nurulakmal Mohd Sharif 3 , Ahmad Azmin Mohamad 1
Affiliation  

Purpose

This paper aims to investigate the morphology and tensile properties of SAC305 solder alloy under the influence of microwave hybrid heating (MHH) for soldering at different microwave parameters.

Design/methodology/approach

Si wafer was used as susceptor in MHH for solder reflow. Microwave operating power for medium and high ranging from 40 to 140 s reflow time was used to investigate their effect on the microstructure and strength of SAC305/Cu solder joints. The morphology and elemental composition of the intermetallic compound (IMC) joint were evaluated on the top surface and cross-sectional view.

Findings

IMC formation transformed from scallop-like to elongated scallop-like structure for medium operating power and scallop-like to planar-like structure for high operating power when exposed to longer reflow time. Compositional and phase analysis confirmed that the observed IMCs consist of Cu6Sn5, Cu3Sn and Ag3Sn. A thinner IMC layer was formed at medium operating power, 80 s (2.4 µm), and high operating power, 40 s (2.5 µm). The ultimate tensile strength at high operating power, 40 s (45.5 MPa), was 44.9% greater than that at medium operating power, 80 s (31.4 MPa).

Originality/value

Microwave parameters with the influence of Si wafer in MHH in soldering have been developed and optimized. A microwave temperature profile was established to select the appropriate parameter for solder reflow. For this MHH soldering method, the higher operating power and shorter reflow time are preferable.



中文翻译:

微波工作功率和回流时间对Sn-3.0Ag-0.5Cu/Cu焊点微观结构和拉伸性能的影响

目的

本文旨在研究在微波混合加热 (MHH) 影响下 SAC305 焊料合金在不同微波参数下焊接的形貌和拉伸性能。

设计/方法/方法

Si 晶片用作 MHH 中的基座以进行回流焊。中高微波工作功率在 40 到 140 秒的回流时间范围内用于研究它们对 SAC305/Cu 焊点的微观结构和强度的影响。金属间化合物 (IMC) 接头的形态和元素组成在顶面和横截面视图上进行评估。

发现

当暴露于较长的回流时间时,IMC 形成从扇贝状转变为拉长的扇贝状结构以获得中等工作功率,而扇贝状结构转变为平面状结构以获得高工作功率。成分和相分析证实观察到的 IMC 由 Cu 6 Sn 5、Cu 3 Sn 和 Ag 3 Sn 组成。在中等工作功率 80 秒 (2.4 µm) 和高工作功率 40 秒 (2.5 µm) 下形成更薄的 IMC 层。高操作功率 40 秒(45.5 兆帕)下的极限抗拉强度比中等操作功率 80 秒(31.4 兆帕)高 44.9%。

原创性/价值

已经开发和优化了受 MHH 中 Si 晶片影响的微波参数。建立微波温度曲线以选择适当的回流焊参数。对于这种 MHH 焊接方法,更高的操作功率和更短的回流时间是可取的。

更新日期:2021-07-28
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