Purpose

This paper aims to investigate the morphology and tensile properties of SAC305 solder alloy under the influence of microwave hybrid heating (MHH) for soldering at different microwave parameters.

Design/methodology/approach

Si wafer was used as susceptor in MHH for solder reflow. Microwave operating power for medium and high ranging from 40 to 140 s reflow time was used to investigate their effect on the microstructure and strength of SAC305/Cu solder joints. The morphology and elemental composition of the intermetallic compound (IMC) joint were evaluated on the top surface and cross-sectional view.

Findings

IMC formation transformed from scallop-like to elongated scallop-like structure for medium operating power and scallop-like to planar-like structure for high operating power when exposed to longer reflow time. Compositional and phase analysis confirmed that the observed IMCs consist of Cu₆Sn₅, Cu₃Sn and Ag₃Sn. A thinner IMC layer was formed at medium operating power, 80 s (2.4 µm), and high operating power, 40 s (2.5 µm). The ultimate tensile strength at high operating power, 40 s (45.5 MPa), was 44.9% greater than that at medium operating power, 80 s (31.4 MPa).

Originality/value

Microwave parameters with the influence of Si wafer in MHH in soldering have been developed and optimized. A microwave temperature profile was established to select the appropriate parameter for solder reflow. For this MHH soldering method, the higher operating power and shorter reflow time are preferable.

中文翻译：

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微波工作功率和回流时间对Sn-3.0Ag-0.5Cu/Cu焊点微观结构和拉伸性能的影响

目的

本文旨在研究在微波混合加热 (MHH) 影响下 SAC305 焊料合金在不同微波参数下焊接的形貌和拉伸性能。

设计/方法/方法

Si 晶片用作 MHH 中的基座以进行回流焊。中高微波工作功率在 40 到 140 秒的回流时间范围内用于研究它们对 SAC305/Cu 焊点的微观结构和强度的影响。金属间化合物 (IMC) 接头的形态和元素组成在顶面和横截面视图上进行评估。

发现

当暴露于较长的回流时间时，IMC 形成从扇贝状转变为拉长的扇贝状结构以获得中等工作功率，而扇贝状结构转变为平面状结构以获得高工作功率。成分和相分析证实观察到的 IMC 由 Cu ₆ Sn ₅、Cu ₃ Sn 和 Ag ₃ Sn 组成。在中等工作功率 80 秒 (2.4 µm) 和高工作功率 40 秒 (2.5 µm) 下形成更薄的 IMC 层。高操作功率 40 秒（45.5 兆帕）下的极限抗拉强度比中等操作功率 80 秒（31.4 兆帕）高 44.9%。

原创性/价值

已经开发和优化了受 MHH 中 Si 晶片影响的微波参数。建立微波温度曲线以选择适当的回流焊参数。对于这种 MHH 焊接方法，更高的操作功率和更短的回流时间是可取的。