A block copolymer that can be thermally cross-linked is synthesized by copolymerization of N-phenyl-2-vinylcarbazole (A) and trimethyl(2-(4-vinylphenyl)ethynyl)silane (B), followed by a deprotection reaction (d-PBAB). A triblock copolymer containing carbazole and (trimethylsilyl)ethynyl groups (PBAB) is first prepared using potassium naphthalenide in tetrahyrdofuran at −78 °C for 60 min. Well-controlled poly(A) and PBAB can be obtained under the conditions employed in this anionic block copolymerization. The well-defined d-PBAB with thermally cross-linkable ethynyl group is then prepared by the deprotection of the trimethylsilyl group from PBAB without side reactions. The thermal cross-linking behavior of d-PBAB is investigated using thermogravimetric analysis and differential scanning calorimetry. The d-PBAB is cross-linked under different conditions, and it is observed that the d-PBAB film heated at 250 °C for 60 min shows excellent solvent resistance and increased film density. In addition, the highest occupied molecular orbital and lowest unoccupied molecular orbital energy levels of cross-linked d-PBAB are estimated to be −5.09 and −1.57 eV, respectively.

通过N-苯基-2-乙烯基咔唑(A)和三甲基 (2-(4-乙烯基苯基) 乙炔基) 硅烷(B)共聚，然后进行脱保护反应 (dP BAB )合成可热交联的嵌段共聚物）。含有咔唑和（三甲基甲硅烷基）乙炔基（P BAB）的三嵌段共聚物首先在四氢呋喃中使用萘化钾在 -78 °C 下制备 60 分钟。在该阴离子嵌段共聚所采用的条件下，可以获得良好控制的聚(A)和P BAB。定义明确的 dP BAB然后通过将三甲基甲硅烷基从 P BAB 上脱保护而没有副反应来制备具有可热交联乙炔基的乙炔基。使用热重分析和差示扫描量热法研究了 dP BAB的热交联行为。dP BAB在不同条件下交联，观察到 dP BAB薄膜在 250°C 加热 60 分钟显示出优异的耐溶剂性和增加的薄膜密度。此外，估计交联 dP BAB的最高占据分子轨道和最低未占据分子轨道能级分别为-5.09 和 -1.57 eV。