Hermetic sealing microelectronic devices in package become more and more of a challenge for manufacturers due to the complexity of thermal management, getter integration, and material selection and interactions. Such complexity drives the original equipment manufacturer (OEM) to deliver the equipment and technology to meet manufacturers’ requirements. This study has successfully demonstrated that a vacuum reflow technology is able to deliver packages with an excellent hermetic seal. The measured leak rates of these two package types are about two orders of magnitude better than the requirement by Mil-Std 883 method 1014 specification. The result is clear that optimization of the force applied to the lid and package during seal process is essential and the force density of 5 kPa is able to produce a great hermeticity for the two packages under study. A good solder joint strength is essential to deliver a package with hermeticity but is not enough, while a weak joint strength is not possible to achieve hermeticity.

中文翻译：

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气密封装微电子器件的先进封装解决方案


由于热管理、吸气剂集成以及材料选择和相互作用的复杂性，封装中的气密密封微电子器件对制造商来说越来越成为挑战。这种复杂性促使原始设备制造商 (OEM) 提供设备和技术来满足制造商的要求。这项研究成功地证明了真空回流技术能够提供具有出色气密密封的封装。这两种封装类型的测量泄漏率比 Mil-Std 883 方法 1014 规范的要求高出大约两个数量级。结果很明显，在密封过程中优化施加到盖子和封装上的力至关重要，5 kPa 的力密度能够为所研究的两个封装产生良好的气密性。良好的焊点强度对于提供气密性封装至关重要，但这还不够，而弱的焊点强度则不可能实现气密性。