A cost-effective ball grid array (BGA) packaged surface-mount off-center-fed dipole antenna element and its array are proposed for 5G millimeter-wave new radio (NR) applications. The proposed antenna element exhibits a compact size of 0.61 λ0 ×0.61 λ0 ×0.16 λ0 ( λ0 is the wavelength in free space at the center operating frequency) and is realized by only one FR4 layer to minimize cost. Plated through holes (PTHs) connect the dipole patch on the top layer to the bottom layer. Furthermore, tin-lead solder balls are mounted under the bottom layer to form the BGA packaging. The surface-mountable feature enables the antenna element to be integrated with other surface mount devices without any waveguide or coaxial connectors. The evaluation board uses a 50- Ω grounded coplanar waveguide (GCPW) line to test the performance of the antenna element and array. The antenna prototype and evaluation board have been manufactured and measured. The measurement results show that the -10-dB impedance bandwidth of the proposed antenna element achieves 35.7% in the range of 25.1-36 GHz. The measured peak gains of the antenna element and the 1 ×8 arrays are 6.72 and 13.53 dBi, respectively.

中文翻译：

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适用于 5G 毫米波新无线电应用的经济高效的表面贴装偏心馈电偶极子天线元件及其阵列


为 5G 毫米波新无线电 (NR) 应用提出了一种经济高效的球栅阵列 (BGA) 封装表面安装偏心馈电偶极子天线元件及其阵列。所提出的天线元件具有 0.61 λ0 ×0.61 λ0 ×0.16 λ0 的紧凑尺寸（λ0 是中心工作频率处自由空间中的波长），并且仅由一层 FR4 层实现，以最大限度地降低成本。电镀通孔 (PTH) 将顶层的偶极子贴片连接到底层。此外，锡铅焊球安装在底层下方以形成BGA封装。表面安装功能使天线元件能够与其他表面安装设备集成，无需任何波导或同轴连接器。该评估板使用 50 Ω 接地共面波导 (GCPW) 线来测试天线元件和阵列的性能。天线原型和评估板已制造并测量。测量结果表明，所提出的天线元件的-10-dB阻抗带宽在25.1-36 GHz范围内达到了35.7%。测得的天线单元和1×8阵列的峰值增益分别为6.72和13.53 dBi。