A cost-effective ball grid array (BGA) packaged surface-mount off-center-fed dipole antenna element and its array are proposed for 5G millimeter-wave new radio (NR) applications. The proposed antenna element exhibits a compact size of $0.61 \,\,\lambda _{0} \times 0.61\,\,\lambda _{0} \times 0.16\,\,\lambda _{0}$ ( $\lambda _{0}$ is the wavelength in free space at the center operating frequency) and is realized by only one FR4 layer to minimize cost. Plated through holes (PTHs) connect the dipole patch on the top layer to the bottom layer. Furthermore, tin-lead solder balls are mounted under the bottom layer to form the BGA packaging. The surface-mountable feature enables the antenna element to be integrated with other surface mount devices without any waveguide or coaxial connectors. The evaluation board uses a 50- $\Omega $ grounded coplanar waveguide (GCPW) line to test the performance of the antenna element and array. The antenna prototype and evaluation board have been manufactured and measured. The measurement results show that the −10-dB impedance bandwidth of the proposed antenna element achieves 35.7% in the range of 25.1–36 GHz. The measured peak gains of the antenna element and the $1 \times 8$ arrays are 6.72 and 13.53 dBi, respectively.

中文翻译：

---

用于 5G 毫米波新无线电应用的经济高效的表面贴装偏心馈电偶极天线元件及其阵列

一种具有成本效益的球栅阵列 (BGA) 封装的表面贴装偏心馈电偶极子天线元件及其阵列被提议用于 5G 毫米波新无线电 (NR) 应用。所提出的天线元件具有紧凑的尺寸 $0.61 \,\,\lambda _{0} \times 0.61\,\,\lambda _{0} \times 0.16\,\,\lambda _{0}$ ( $\lambda _{0}$ 是中心工作频率下自由空间中的波长），并且仅通过一个 FR4 层实现，以最大限度地降低成本。镀通孔 (PTH) 将顶层的偶极贴片连接到底层。此外，锡铅焊球安装在底层下方以形成 BGA 封装。可表面安装的特性使天线元件能够与其他表面安装设备集成，而无需任何波导或同轴连接器。评估板使用 50- $\欧米茄 $ 接地共面波导 (GCPW) 线以测试天线元件和阵列的性能。天线原型和评估板已经制造和测量。测量结果表明，所提出的天线元件的 -10-dB 阻抗带宽在 25.1-36 GHz 范围内达到 35.7%。天线元件的测量峰值增益和 $1 \times 8$ 阵列分别为 6.72 和 13.53 dBi。