Abstract

This article discusses the production of composite material by chip electroslag cladding using non-consumable electrodes. It has been demonstrated that, contrary to conventional discrete additives (shot, cut wire, granules, and others), the final composite material is characterized by complex structural phase composition upon chip cladding, which is determined not only by the cladding parameters but also by the production history of the chip itself: conditions of mechanical and thermal treatment. Test claddings and commercial recovery claddings of dies have been performed, allowing to estimate not only structure formation peculiarities of cladded composite material but also its mechanical properties. The performed tests make it possible to recommend this type of additive and its technology for cladding of wear resistant layers gaining both economic and environmental advantages.

中文翻译：

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非自耗电极电渣熔覆法制备切屑增强复合材料

摘要

本文讨论了使用非自耗电极通过芯片电渣熔覆生产复合材料。已经证明，与传统的离散添加剂（丸粒、切丝、颗粒等）相反，最终复合材料的特征在于芯片包覆时复杂的结构相组成，这不仅由包覆参数决定，还取决于芯片本身的生产历史：机械和热处理条件。已经进行了模具的测试包层和商业回收包层，不仅可以估算包层复​​合材料的结构形成特性，还可以估算其机械性能。