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Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies
Soldering & Surface Mount Technology ( IF 1.7 ) Pub Date : 2021-07-22 , DOI: 10.1108/ssmt-12-2020-0055
Leonid Anatolevich Olenev 1 , Rafina Rafkatovna Zakieva 2 , Nina Nikolaevna Smirnova 3 , Rustem Adamovich Shichiyakh 4 , Kirill Aleksandrovich Ershov 5 , Nisith Geetha 6
Affiliation  

Purpose

This study aims to present a more accurate lifetime prediction model considering solder chemical composition.

Design/methodology/approach

Thermal cycling and standard creep tests as well as finite element simulation were used.

Findings

The study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved.

Originality/value

It is confirmed.



中文翻译:

电子组件中沙漏型焊点的准确组成依赖热机械寿命估计

目的

本研究旨在提出一个考虑焊料化学成分的更准确的寿命预测模型。

设计/方法/方法

使用了热循环和标准蠕变测试以及有限元模拟。

发现

研究发现焊点寿命评估中的误差较低。Ag含量越高,实现的寿命就越高。

原创性/价值

已经确认。

更新日期:2021-07-22
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