Abstract

This investigation is aimed at the design and optimization of boron arsenide insert structures embedded in the heat spreader of a 3-D Integrated Circuit (IC). The inserts are distributed in three main configurations: radial, one level of pairing, and two levels of pairing. The considered heat spreader is constituted of a composite of copper and highly conductive blades made of boron arsenide with high thermal conductivity. The structures corresponding to the lowest maximum temperature of the 3-D IC while the ratio of the boron arsenide volume to the whole heat spreader volume is fixed, are established. Four different boundary conditions are examined to seek their impact on the optimal configuration of the inserts. The results show that for the constant temperature, variable temperature, convection heat transfer boundary conditions at optimal conditions, the maximum temperature of the whole structure (the structures have not been defined) can be reduced by 13.7%, 11.9%, and 13.9%, respectively; while the size of the plain heat spreader (without HCI) was 200% larger than the recommended HCI embedded one.

摘要

本研究旨在设计和优化嵌入 3D 集成电路 (IC) 散热器中的砷化硼插入结构。刀片分布在三种主要配置中：径向、一级配对和二级配对。所考虑的散热器由铜和具有高导热性的砷化硼制成的高导热叶片的复合材料构成。在砷化硼体积与整个散热器体积的比率固定的情况下，建立了对应于 3-D IC 的最低最高温度的结构。检查了四种不同的边界条件，以寻找它们对刀片最佳配置的影响。结果表明，对于恒温、变温、对流换热边界条件在最优条件下，整个结构（未定义结构）的最高温度可分别降低13.7%、11.9%和13.9%；而普通散热器（无 HCI）的尺寸比推荐的 HCI 嵌入式散热器大 200%。