With the development of the automotive industry, the number of automotive electronic components is growing rapidly. This leads to new requirements for reliability of the automotive electronics. Especially, for difficult operating environments, such as engine compartment of the car, extreme thermal cycles, and long holding time, where prediction of the fatigue life of the component is particularly important. In this study, thermal fatigue life prediction models for two packages are proposed: TSOP over BGA, and flip chip with BGA. The overall deformation of the two packages was analyzed using Moiré fringes, and was found to be consistent with simulation results. The reliability of the model was verified by comparing thermal shock results and simulation results. Then, the fatigue life of the component under thermal cycles was predicted using the model. The overall component life of the BGA with flip chip package was 818 cycles. For TSOP over BGA this was 1005 cycles, but the shortest life of the BGA was 725 cycles, which may result in the failure of the entire component. The fatigue life prediction using different models is helpful to assess and optimize components at the early stage of product development.

随着汽车工业的发展，汽车电子元器件的数量也在快速增长。这对汽车电子的可靠性提出了新的要求。尤其是在汽车发动机舱、极端热循环、长时间保持等恶劣的工作环境中，部件疲劳寿命的预测尤为重要。在这项研究中，提出了两种封装的热疲劳寿命预测模型：BGA 上的 TSOP 和 BGA 倒装芯片。使用莫尔条纹分析了两种封装的整体变形，发现与模拟结果一致。通过对比热冲击结果和仿真结果，验证了模型的可靠性。然后，使用该模型预测部件在热循环下的疲劳寿命。采用倒装芯片封装的 BGA 的整体组件寿命为 818 次循环。对于 BGA 上的 TSOP，这是 1005 次循环，但 BGA 的最短寿命是 725 次循环，这可能会导致整个组件出现故障。使用不同模型的疲劳寿命预测有助于在产品开发的早期阶段评估和优化组件。