An experimental investigation has been observed on hardness, sintered density and corrosion behaviour of two-layered structured Al-xCu/Al sample through powder metallurgical route under hot compaction condition. The samples were prepared with different percentages of Cu content (x: 5 wt. %, 10 wt. % and 15 wt. %) in the aluminium matrix with a constant pressure of 400 MPa with different hot-pressed temperatures (500 °C, 550 °C and 600 °C) at a dwelling time of 3 h. The developed two-layered samples microstructure was analysed using the optical and scanning electron microscope. The highest value of micro-hardness (100.6 HV) was obtained at interface region of 15% of copper at 550 °C. The corrosion rate of Al-Cu/Al two-layered samples at the interface were analyzed through the potentiodynamic polarization test and found that with addition of copper content the susceptibility of corrosion increases. The Electrochemical Impedance Spectroscopy (EIS) test was conducted to know the equivalent circuit model, which provides a minimum chi-square value and that circuit model taken as best-fit circuit model. From the EIS results, it was found that 10 wt. %Cu sample circuit provides minimum chi-square value.

通过粉末冶金路线在热压条件下观察了两层结构的Al-xCu/Al样品的硬度、烧结密度和腐蚀行为的实验研究。在 400 MPa 的恒压和不同的热压温度 (500 °C, 550 °C 和 600 °C），停留时间为 3 小时。使用光学和扫描电子显微镜分析开发的两层样品微观结构。显微硬度的最高值 (100.6 HV) 在 550 °C 下含 15% 铜的界面区域获得。通过动电位极化试验分析了Al-Cu/Al两层试样在界面处的腐蚀速率，发现随着铜含量的增加，腐蚀敏感性增加。进行电化学阻抗谱 (EIS) 测试以了解等效电路模型，该模型提供最小卡方值并将该电路模型作为最佳拟合电路模型。根据 EIS 结果，发现 10 wt. %Cu 采样电路提供最小卡方值。