Tungsten‑copper (WCu) composites/pseudo alloys with excellent properties are extremely desirable for applications as electrode materials, functional graded materials, electronic packaging materials, electrical contacts, as well as other aerospace and military candidates. This paper reviewed the recent progress on fabrication techniques, microstructure and property regulation that ensure high-performance WCu alloys. Besides the well-developed traditional powder metallurgy including the parameter modification, powder pre-treatment and severe plastic deformation post-treatment, extensive novel sintering or manufacturing techniques including microwave sintering, spark plasma sintering, field-assisted sintering and additive manufacturing of WCu alloys are reviewed, along with various chemical methods for nano-powder synthesis. Subsequently, the microstructure and property regulation by pure metal elements and introduction of second phases with great details are provided. Based on the review with all-sided perspectives for WCu alloys, future developments and potential research challenges for WCu alloys are summarized and proposed finally.

具有优异性能的钨铜 (W Cu) 复合材料/伪合金非常适合用作电极材料、功能梯度材料、电子封装材料、电触点以及其他航空航天和军事候选材料。本文回顾了确保高性能钨铜合金的制造技术、微观结构和性能调节的最新进展。除了先进的传统粉末冶金技术（包括参数修改、粉末前处理和剧烈塑性变形后处理）外，还有广泛的新型烧结或制造技术，包括微波烧结、放电等离子烧结、场辅助烧结和增材制造。回顾了铜合金，以及用于纳米粉末合成的各种化学方法。随后，详细介绍了纯金属元素对微观结构和性能的调节以及第二相的引入。在对钨铜合金进行全方位的回顾的基础上，最后总结并提出了钨铜合金的未来发展和潜在的研究挑战。