Abstract

Microchannel is helpful for cooling the microelectronic devices with high heat flux. In this study, topology optimization method with three objective functions (pumping power, bottom wall mean temperature and temperature uniformity) is adopted to optimize the structure of a manifold microchannel. The field synergy principle is used to evaluate the optimized structures. Several single-objective, bi-objective, and triple-objective function problems are numerically studied. It is found that the obtained structures with better cooling performance always present low synergy angle, in consistent with the field synergy principle. The optimized structures perform better than conventional microchannel with ribs. Effects of inlet velocity, thermal diffusivity ratio and heat flux at the bottom wall are also investigated. The topology optimization method with triple-objective functions is effective to improve the performance of manifold microchannels.

摘要

微通道有助于冷却具有高热通量的微电子器件。本研究采用具有三个目标函数（泵功率、底壁平均温度和温度均匀性）的拓扑优化方法来优化歧管微通道的结构。场协同原理用于评估优化结构。数值研究了几个单目标、双目标和三目标函数问题。发现获得的具有更好冷却性能的结构总是呈现出较低的协同角，这与场协同原理是一致的。优化的结构比传统的带肋的微通道性能更好。还研究了入口速度、热扩散率和底壁处的热通量的影响。