Ni thin films have been electrodeposited on n-Si (100) substrates for different deposition times at a fixed potential of 2V. The as-elaborated films have been characterized by Rutherford backscattering spectroscopy (RBS), X-ray diffraction (XRD), atomic force microscopy (AFM) and vibrating sample magnetometry (VSM). From RBS spectra, we have extracted the Ni film thicknesses, t(nm), which ranges from 105 nm to 710 nm. The analysis of XRD spectra shows the existence of a strong ⟨111⟩ texture for all film thicknesses. The strain values εhkl are negative for all Ni films indicating that they are under compressive stresses. The grains size, 〈D(Å)〉, increases to reach a maximum for t=465nm then decreases again with increasing t(nm). From AFM images, we have shown that the films become progressively smoother with increasing thickness. We have shown that the coercive field measured in parallel geometry, HC||, increases with increasing thickness.

中文翻译：

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电沉积镍薄膜的结构、形态和磁性

镍薄膜已电沉积在n-Si (100) 衬底，用于不同沉积时间，固定电位为 2V. 所制备的薄膜已通过卢瑟福背散射光谱 (RBS)、X 射线衍射 (XRD)、原子力显微镜 (AFM) 和振动样品磁强计 (VSM) 进行了表征。从 RBS 光谱中，我们提取了 Ni 膜的厚度，吨(纳米)，范围从 105 nm 到 710 nm。XRD谱分析表明存在强⟨111⟩所有薄膜厚度的纹理。应变值εHķl所有 Ni 薄膜均为负值，表明它们处于压缩应力下。颗粒大小，〈D(一种)〉, 增加到最大值吨=465nm 然后随着增加再次减小吨（纳米）。从 AFM 图像中我们可以看出，随着厚度的增加，薄膜会变得越来越光滑。我们已经证明，在平行几何中测量的矫顽场，HC||, 随着厚度的增加而增加。