Green computing is an important factor to ensure the eco-friendly use of computers and their resources. Electric power used in a computer converts into heat and thus, the system takes fewer watts ensuring less cooling. This lower energy consumption allows to be less costly to run as well as reduces the environmental impact of powering the computer. One of the most challenging problems for the modern green supercomputers is the reduction of current power consumptions. Consequently, regular conventional interconnection networks also show poor cost performance. On the other hand, hierarchical interconnection networks (like-3D-TTN) can be a possible solution to those issues. The main focus for this paper is the estimation of power usage at the on-chip level for 3D-TTN with the various other networks along with the analysis of static network performance. In our analysis, 3D-TTN requires about 32.48% less router power usage at the on-chip level and can also achieve near about 21% better diameter performance as well as 12% better average distance performance than the 5D-Torus network. Similarly, it also requires only about 14.43% higher router power usage; however, can achieve 23.21% better diameter performance and 26.3% better average distance than recent hierarchical interconnection network- 3D-TESH. The most attractive feature of this paper is the static hop distance parameter and per watt analysis (power-performance). According to our power-performance results, 3D-TTN can also show better result than the 3D-Mesh, 2D-Mesh, 2D-Torus and 3D-TESH network even at the lowest network level. Moreover, this paper is also featured with the static effectiveness analysis, which ensures cost and time efficiency of 3D-TTN.

中文翻译：

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3D-TTN：用于下一代绿色超级计算机的节能、经济高效的高性能分层互连网络。

绿色计算是确保计算机及其资源的环保使用的重要因素。计算机中使用的电能会转化为热量，因此系统消耗的功率更少，从而确保更少的冷却。这种较低的能耗可以降低运行成本，并减少为计算机供电的环境影响。现代绿色超级计算机最具挑战性的问题之一是降低当前的功耗。因此，常规的传统互连网络也表现出较差的性价比。另一方面，分层互连网络（如 3D-TTN）可能是这些问题的解决方案。本文的主要重点是在片上级别估计 3D-TTN 与各种其他网络的功耗以及静态网络性能分析。在我们的分析中，与 5D-Torus 网络相比，3D-TTN 需要在片上级别减少约 32.48% 的路由器功耗，并且还可以实现约 21% 更好的直径性能以及 12% 的平均距离性能。同样，它也只需要高出约 14.43% 的路由器用电量；然而，与最近的分层互连网络 - 3D-TESH 相比，可以实现 23.21% 更好的直径性能和 26.3% 的平均距离。本文最吸引人的特点是静态跳跃距离参数和每瓦分析（功率性能）。根据我们的功率性能结果，3D-TTN 也可以显示比 3D-Mesh 更好的结果，2D-Mesh、2D-Torus 和 3D-TESH 网络，即使在最低网络级别。此外，本文还进行了静态有效性分析，确保了 3D-TTN 的成本和时间效率。