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A simplified cascade-based de-embedding technique for on-wafer microwave characterization of thin-film resistors and transmission lines
Microwave and Optical Technology Letters ( IF 1.0 ) Pub Date : 2021-07-17 , DOI: 10.1002/mop.32977
Zhennan Wei 1 , Fengyi Huang 1 , Xusheng Tang 1 , Nan Jiang 2
Affiliation  

A cascade-based de-embedding technique is presented for microwave characterization of thin-film resistors and transmission lines. Parasitic effects of the probe pads, on-chip interconnects and access via holes can be directly extracted using two devices under test without resorting to any additional Open/Thru dummy structures. The proposed matrix transformation provides a simplified de-embedding methodology with a high precision similar to the conventional approaches using multiple dummy structures. The validity of the proposed technique has been demonstrated for GaN thin-film resistors up to 65 GHz.

中文翻译:

一种简化的基于级联的去嵌入技术,用于薄膜电阻器和传输线的晶圆上微波表征

提出了一种基于级联的去嵌入技术,用于薄膜电阻器和传输线的微波表征。可以使用两个被测器件直接提取探针焊盘、片上互连和通路孔的寄生效应,而无需求助于任何额外的开路/直通虚拟结构。所提出的矩阵变换提供了一种简化的去嵌入方法,其精度类似于使用多个虚拟结构的传统方法。所提出的技术的有效性已在高达 65 GHz 的 GaN 薄膜电阻器上得到证明。
更新日期:2021-09-01
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