Electrospun unidirectional SiC fibers reinforced SiC_f/SiC composites (e-SiC_f/SiC) were prepared with ∼10% volume fraction by polymer infiltration and pyrolysis (PIP) process. Pyrolysis temperature was varied to investigate the changes in microstructures, mechanical, thermal, and dielectric properties of e-SiC_f/SiC composites. The composites prepared at 1100 °C exhibit the highest flexural strength of 286.0 ± 33.9 MPa, then reduced at 1300 °C, mainly due to the degradation of electrospun SiC fibers, increased porosity, and reaction-controlled interfacial bonding. The thermal conductivity of e-SiC_f/SiC prepared at 1300 °C reached 2.663 W/(m∙K). The dielectric properties of e-SiC_f/SiC composites were also investigated and the complex permittivities increase with raising pyrolysis temperature. The e-SiC_f/SiC composites prepared at 1300 °C exhibited EMI shielding effectiveness exceeding 24 dB over the whole X band. The electrospun SiC fibers reinforced SiC_f/SiC composites can serve as a potential material for structural components and EMI shielding applications in the future.

通过聚合物渗透和热解（PIP）工艺制备了体积分数约为 10% 的电纺单向 SiC 纤维增强 SiC _f / SiC 复合材料（e-SiC _f / SiC）。改变热解温度以研究 e-SiC _f / SiC 复合材料的微观结构、机械、热和介电性能的变化。在 1100 °C 制备的复合材料表现出最高的弯曲强度 286.0 ± 33.9 MPa，然后在 1300 °C 时降低，这主要是由于电纺 SiC 纤维的降解、孔隙率增加和反应控制的界面结合。在 1300 °C 下制备的 e-SiC _f /SiC的热导率达到 2.663 W/(m∙K)。e-SiC _f的介电性能还研究了 /SiC 复合材料，复合介电常数随着热解温度的升高而增加。在 1300 °C 下制备的 e-SiC _f /SiC 复合材料在整个 X 波段表现出超过 24 dB 的 EMI 屏蔽效率。电纺 SiC 纤维增强 SiC _f / SiC 复合材料可作为未来结构部件和 EMI 屏蔽应用的潜在材料。