This work focuses on studying the effect of bath chemical composition, applied current and deposition time on the morphology, composition and corrosion characterization of the deposited Ni–Cu nano metallic foams (NMFs) using Dynamic Hydrogen Bubble Template (DHBT) technique. The Ni content of the deposited layer was ranged from 50 to 57% and the copper content ranged from 8 to 21%. The corrosion characterization of these NMFs was evaluated in 1 M acidic methanol solution by potentiodynamic polarization tests, cyclic voltammetry, and EIS. At high current density, typical dendritic morphology was developed. From the potentiodynamic test, the lowest corrosion rate was 0.089 mpy for layer deposited at 0.6 A/cm² for 30 sec. Increasing both the applied current density and the time of deposition lead to increasing of the forward peak intensity and total charge measured by cyclic voltammetry showing a remarkable effect on the electrochemical activity of the films. From the EIS test, it was observed that the polarization resistance (R_po) decreased as well as the applied electrodeposition time increased. The highest polarization resistance was 272 O at 0.6 A/cm² for 30 sec, reflecting the highest corrosion resistance.

这项工作的重点是使用动态氢气泡模板 (DHBT) 技术研究镀液化学成分、施加的电流和沉积时间对沉积的 Ni-Cu 纳米金属泡沫 (NMF) 的形态、成分和腐蚀特征的影响。沉积层的镍含量范围为 50% 至 57%，铜含量范围为 8% 至 21%。通过动电位极化测试、循环伏安法和 EIS 在 1 M 酸性甲醇溶液中评估了这些 NMF 的腐蚀特性。在高电流密度下，形成了典型的树枝状形态。根据动电位测试，对于以 0.6 A/cm ²沉积的层，最低腐蚀速率为 0.089 mpy30 秒。增加施加的电流密度和沉积时间导致正向峰强度和循环伏安法测量的总电荷增加，显示出对薄膜电化学活性的显着影响。从 EIS 测试中，观察到极化电阻 (R _po ) 降低以及施加的电沉积时间增加。最高的极化电阻为 272 O 在 0.6 A/cm ^{2 下}持续 30 秒，反映了最高的耐腐蚀性。