Abstract

The paper investigates the result of v-scoring impact by laser radiation in water medium applied on silicon very large-scale integration circuits employed in hybrid photodetectors of infrared radiation. The width of material damage around the score line is established to be approximately 47 \({\mu}\)m. The appearance of hydraulic shock in the course of water boiling during v-scoring is discovered; its pressure on material is not less than \(1.5\times 10^{-6}\) kg/\({\mu}\)m\({}^{2}\).

中文翻译：

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在水介质中通过激光辐射对硅仪表盘进行 V 刻划

摘要

本文研究了激光辐射在水介质中对用于红外辐射混合光电探测器的硅超大规模集成电路的 v-scoring 影响的结果。刻痕线周围材料损坏的宽度被确定为大约 47 \({\mu}\) m。发现v-scoring过程中水沸腾过程中出现液压冲击；它对材料的压力不小于\(1.5\times 10^{-6}\) kg/ \({\mu}\) m \({}^{2}\)。