Electromagnetic shielding performance has been achieved for a polyimide (PI)-matrix composite by the strategy of self-metallization of its thermosetting PI matrix. Self-metallization of the thermosetting PI was realized by silver ion/poly(amic acid) (PAA) precursor ion exchange and thermal reduction. The factors influencing the self-metallization were investigated. The electrical conductivity and integrity for the surface of the PI were achieved by optimization of ion exchange/thermal reduction parameters. The fabricated PI-matrix composite exhibits a maximum electromagnetic interference shielding effectiveness value of 81 dB. Importantly, the electromagnetic shielding performance can be maintained even after heat condition of 300°C. Meanwhile, the surface-metallized PI composite exhibits mechanical property equivalent to the pristine composite, and an Ag/matrix interfacial strength higher than 19.6 MPa. Besides, self-metallization mechanism of the thermosetting PI was investigated.

通过其热固性 PI 基体的自金属化策略，聚酰亚胺 (PI)-基体复合材料已实现电磁屏蔽性能。热固性 PI 的自金属化是通过银离子/聚酰胺酸 (PAA) 前体离子交换和热还原实现的。研究了影响自金属化的因素。PI 表面的导电性和完整性是通过优化离子交换/热还原参数实现的。制造的 PI 矩阵复合材料的最大电磁干扰屏蔽效率值为 81 dB。重要的是，即使在 300°C 的加热条件下也能保持电磁屏蔽性能。同时，表面金属化的 PI 复合材料表现出与原始复合材料相当的机械性能，和高于 19.6 MPa 的 Ag/基质界面强度。此外，研究了热固性PI的自金属化机制。