Electronics is the vital basis for innovations and the essential enabler for global trends like connectivity, electro mobility and renewable energies. These applications require high performance and reliability of the electronic modules. Their assembly combines very heterogeneous process chains like remarkable productive and diminutive surface mount technology (SMT), powerful and robust power electronic interconnection techniques, as well as pioneering reel-to-reel based organic electronic printing. After briefly outlining the enormous global economic impact of electronic modules, this paper presents the state of the art of electronic module assembly including substrate materials, electronic components, packaging and assembly processes as well as quality and reliability testing methods.

电子产品是创新的重要基础，也是连通性、电动汽车和可再生能源等全球趋势的重要推动力。这些应用需要电子模块的高性能和可靠性。他们的组装结合了非常多样化的工艺链，如卓越的高效和小型表面贴装技术 (SMT)、强大而稳健的电力电子互连技术，以及开创性的基于卷对卷的有机电子印刷。在简要概述电子模块对全球经济的巨大影响之后，本文介绍了电子模块组装的最新技术，包括基板材料、电子元件、封装和组装工艺以及质量和可靠性测试方法。