Journal of the Taiwan Institute of Chemical Engineers ( IF 5.5 ) Pub Date : 2021-07-08 , DOI: 10.1016/j.jtice.2021.06.034 Ruxia Zhang 1, 2, 3 , Chengmei Gui 2, 3, 4 , Junjun Huang 2, 4, 5 , Guisheng Yang 1, 2, 3
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Background
Electroless plating is a simple and promising method to fabricate surface-metallization material, low rupture work of plated coating and complex production process become important factors that restrict its progress.
Methods
In this study, silane (3-aminopropyltriethoxysilane (KH550) and γ-(2,3-epoxypropoxy)propytrimethoxysilane (KH560)) was incorporated in AgNO3 solution to rational preparing Ag nanoparticle/polymer brush (Ag/PB) catalytic solution and its application in electroless deposition to fabricate adhesion-enhanced copper pattern for functional flexible electronics.
Significant findings
The epoxy group in the KH560 can react with amino group in the KH550 through direct ring-opening reaction to form secondary amino group and hydroxyl, which could co-adsorb Ag nanoparticle by means of chelating structure, which exhibited superior Ag/PB interfacial characterization. As a result, Ag/PB was established on polyethylene terephthalate surface to achieve the modification of substrate with excellent adhesion and the catalysis of electroless copper plating when the PB is a mixture of AgNO3 and silane (75% KH560 and 25% KH550). Both maximum effective thickness and rupture work of Cu-plated coating were improved with the incremental rate of about 30% and 33%, respectively.
中文翻译：
银纳米粒子/聚合物刷的合理设计及其在化学沉积中的应用，以制作功能性柔性电子产品的附着力增强铜图案
背景
化学镀是制备表面金属化材料的一种简单而有前景的方法，镀层的低破裂功和复杂的生产工艺成为制约其发展的重要因素。
方法
本研究将硅烷（3-氨基丙基三乙氧基硅烷（KH550）和γ-（2,3-环氧丙氧基）丙基三甲氧基硅烷（KH560））掺入AgNO 3溶液中，合理制备Ag纳米粒子/聚合物刷（Ag/PB）催化溶液及其催化作用。在化学沉积中的应用，以制造用于功能性柔性电子产品的附着力增强的铜图案。
重要发现
KH560中的环氧基与KH550中的氨基直接开环反应生成仲氨基和羟基，通过螯合结构共吸附Ag纳米颗粒，表现出优异的Ag/PB界面表征。因此，当PB是AgNO 3和硅烷的混合物（75% KH560和25% KH550）时，在聚对苯二甲酸乙二醇酯表面上建立Ag/PB以实现具有优异附着力的基材改性和化学镀铜的催化。镀铜涂层的最大有效厚度和断裂功均以约 30% 和 33% 的增量率分别提高。
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