ABSTRACT

This study focuses on overmolding, a unique injection molding process. It enables a seamless combination of multiple materials into a single part. The bottleneck of overmolding is the interface strength between the paired elements. Interface strength depends on numerous factors, such as the interface topology, the physical and chemical properties of the paired materials, and the processing parameters of overmolding. These factors have a large number of possible combinations. This necessitates a modeling approach to predict the interface properties and find the optimal processing parameters of overmolding at an early design stage. Although injection molding is a well-known field for simulation, adhesion modeling between the substrate and overmolded elements is missing in all available simulation software. Our goal is to develop a simulation methodology that combines analytical models with simulation tools, to predict interface strength during overmolding. The principal novelty of the proposed methodology is that it considers the space-time dependency of the interface temperature – this has a significant influence on interface strength. We proved that the methodology we developed gives the most accurate results; it predicts the bonding strength of overmolded ABS, PC and PS parts with an error of less than 7%.

摘要

本研究侧重于包覆成型，这是一种独特的注塑成型工艺。它可以将多种材料无缝组合到一个零件中。包覆成型的瓶颈是成对元件之间的界面强度。界面强度取决于许多因素，例如界面拓扑结构、配对材料的物理和化学性质以及包覆成型的加工参数。这些因素有大量可能的组合。这需要一种建模方法来预测界面特性并在早期设计阶段找到包覆成型的最佳工艺参数。尽管注塑成型是一个众所周知的仿真领域，但在所有可用的仿真软件中都缺少基材和包覆成型元件之间的粘附建模。我们的目标是开发一种模拟方法，将分析模型与模拟工具相结合，以预测包覆成型期间的界面强度。所提出的方法的主要新颖之处在于它考虑了界面温度的时空依赖性——这对界面强度有重大影响。我们证明了我们开发的方法给出了最准确的结果；它以小于 7% 的误​​差预测包覆成型 ABS、PC 和 PS 零件的粘合强度。我们证明了我们开发的方法给出了最准确的结果；它以小于 7% 的误​​差预测包覆成型 ABS、PC 和 PS 零件的粘合强度。我们证明了我们开发的方法给出了最准确的结果；它以小于 7% 的误​​差预测包覆成型 ABS、PC 和 PS 零件的粘合强度。