Current trends in microelectronics chip bonding and assembly encompass ultra-fine pitch components with flexible form factors and advanced die-attach materials, which can sustain conformal strain without compromise in adhesion and reliability. These trends have highlighted the need for advanced microfrabrication technologies, which allow the on-demand digital fabrication of interconnections and die-attach bumps on chip carriers and interposers with challenging topographies. Laser printing, based on the laser induced forward transfer (LIFT) technique, has addressed such micromanufacturing challenges over the past decade. Several previous demonstrations of highly resolved and conformal interconnections for the bonding and packaging of micro and opto-electronic components are summarized in this paper. Latest advances in the laser printing and laser sintering of highly viscous nanopastes for achieving planar or three-dimensional (3D) structures consisting of Ag paste are demonstrated. The latter is achieved by stacking of arrays or bumps in a digital manner. The reported results verify that LIFT offers control over both the lateral and vertical dimensions. This control can facilitate the soldering process of heterogeneous components, whose pads have significant height and pitch dissimilarities. The applicability of LIFT in the fields of packaging and assembly of flexible and heterogeneous integration schemes, is further validated.

中文翻译：

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激光诱导前向转移 (LIFT) 技术作为电子元件组装和封装的替代方案

微电子芯片键合和组装的当前趋势包括具有灵活外形和先进芯片连接材料的超细间距组件，这些组件可以承受保形应变，而不会影响粘附性和可靠性。这些趋势凸显了对先进微细加工技术的需求，该技术允许在具有挑战性拓扑结构的芯片载体和中介层上按需数字制造互连和芯片连接凸点。在过去十年中，基于激光诱导正向转移 (LIFT) 技术的激光打印解决了此类微制造挑战。本文总结了先前用于微电子和光电元件的键合和封装的高分辨率和共形互连的几个演示。展示了用于实现由银浆组成的平面或三维 (3D) 结构的高粘性纳米膏的激光印刷和激光烧结的最新进展。后者是通过以数字方式堆叠阵列或凸块来实现的。报告的结果证实 LIFT 可以控制横向和垂直维度。这种控制可以促进异类元件的焊接过程，这些元件的焊盘具有显着的高度和间距差异。LIFT 在柔性和异构集成方案的封装和组装领域的适用性得到进一步验证。报告的结果证实 LIFT 可以控制横向和垂直维度。这种控制可以促进异质组件的焊接过程，这些组件的焊盘具有显着的高度和间距差异。LIFT 在柔性和异构集成方案的封装和组装领域的适用性得到进一步验证。报告的结果证实 LIFT 可以控制横向和垂直维度。这种控制可以促进异质组件的焊接过程，这些组件的焊盘具有显着的高度和间距差异。LIFT 在柔性和异构集成方案的封装和组装领域的适用性得到进一步验证。