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Tailoring the Surface Characteristics of CuSe Thin Films by Adjusting the Compositional Ratio
Physica Status Solidi (A) - Applications and Materials Science Pub Date : 2021-06-30 , DOI: 10.1002/pssa.202100148
Jihyeon Lee 1 , Donghyun Kim 1 , Juyun Park 1 , Jin‐Woo Oh 2 , Yong‐Cheol Kang 1
Affiliation  

Using radio frequency (RF) magnetron cosputtering, copper selenide thin films (TFs) with various ratios of Se are fabricated herein. To observe how the chemical and physical properties change based on morphology, the ratio of metallic Cu to nonmetallic Se is tuned to form multiple different compositions. The compositional percentage of the surface is determined by X-ray photoelectron spectroscopy (XPS). Noticeable transitions of the characteristics of TFs are affected by Cu to a higher degree than Se. Larger grain sizes are observed when the Se ratio is high in Cu-rich TFs. Most copper selenide TFs are hydrophobic and portray these characteristics the strongest when the surface Se ratio of TF is 16.62% as the contact angle with distilled water is 129°. In addition, the electrical conductivity is the highest at 2.04 (±0.13) × 107 S m−1 when the surface Se ratio is 10.95%.

中文翻译:

通过调整成分比来调整CuSe薄膜的表面特性

使用射频 (RF) 磁控管共溅射,本文制造了具有各种 Se 比例的硒化铜薄膜 (TF)。为了观察化学和物理性质如何根据形态变化,调整金属 Cu 与非金属 Se 的比例以形成多种不同的成分。表面的组成百分比由 X 射线光电子能谱 (XPS) 确定。TFs 特性的显着转变受 Cu 的影响程度高于 Se。当富铜 TF 中的 Se 比率高时,观察到较大的晶粒尺寸。大多数硒化铜 TFs 是疏水的,当 TF 的表面 Se 比率为 16.62% 时,当与蒸馏水的接触角为 129° 时,这些特性表现得最强。此外,电导率最高为2.04(±0.13)×10当表面Se比率为10.95%时为7  S m -1
更新日期:2021-08-07
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