Purpose

The simulated temperature profile of the printed circuit board assembly (PCBA) during reflow soldering process deviates from the actual profile. To reduce this relative deviation, a new strategy based on the Kriging response surface and the Multi-Objective Genetic Algorithm (MOGA) optimizing method is proposed.

Design/methodology/approach

The simulated temperature profile of the PCBA during reflow soldering process deviates from the actual profile. To reduce this relative deviation, a new strategy based on the Kriging response surface and the MOGA optimizing method is proposed.

Findings

Several critical influencing parameters such as temperature and the convective heat transfer coefficient of the specific temperature zones are selected as the correction parameters. The hyper Latins sampling method is implemented to distribute the design points, and the Kriging response surface model of the soldering process is constructed. The updated model is achieved and validated by the test. The relative derivation is reduced from the initial value of 43.4%–11.8% in terms of the time above the liquidus line.

Originality/value

A new strategy based on the Kriging response surface and the MOGA optimizing method is proposed.

中文翻译：

---

基于Kriging模型的印刷电路板组件温度场仿真模型更新

目的

回流焊接过程中印刷电路板组件 (PCBA) 的模拟温度曲线与实际曲线存在偏差。为了减少这种相对偏差，提出了一种基于克里金响应面和多目标遗传算法（MOGA）优化方法的新策略。

设计/方法/方法

PCBA 在回流焊接过程中的模拟温度曲线与实际曲线存在偏差。为了减小这种相对偏差，提出了一种基于克里金响应面和MOGA优化方法的新策略。

发现

选取温度、特定温区的对流传热系数等几个关键影响参数作为修正参数。采用超拉丁抽样法对设计点进行分布，构建焊接过程的克里金响应面模型。通过测试实现并验证了更新的模型。在液相线以上的时间方面，相对导数从初始值的 43.4% 减少到 11.8%。

原创性/价值

提出了一种基于克里金响应面和MOGA优化方法的新策略。