Increasing demand for every faster information throughput is driving the emergence of integrated photonic technology. The traditional silicon platform used for integrated electronics cannot provide all of the functionality required for fully integrated photonic circuits, and thus, the last decade has seen a strong increase in research and development of hybrid and heterogeneous photonic integrated circuits. These approaches have enabled record breaking experimental demonstrations, harnessing the most favorable properties of multiple material platforms, while the robustness and reliability of these technologies are suggesting entirely new approaches for precise mass manufacture of integrated circuits with unprecedented variety and flexibility. This Tutorial provides an overview of the motivation behind the integration of different photonic and material platforms. It reviews common hybrid and heterogeneous integration methods and discusses the advantages and shortcomings. This Tutorial also provides an overview of common photonic elements that are integrated in photonic circuits. Finally, an outlook is provided about the future directions of the hybrid/heterogeneous photonic integrated circuits and their applications.

中文翻译：

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混合和异构光子集成

对更快信息吞吐量的需求不断增加，这推动了集成光子技术的出现。用于集成电子器件的传统硅平台无法提供完全集成光子电路所需的所有功能，因此，在过去十年中，混合和异构光子集成电路的研究和开发大幅增加。这些方法实现了破纪录的实验演示，利用了多种材料平台的最有利特性，而这些技术的稳健性和可靠性则为集成电路的精确大规模制造提供了全新的方法，具有前所未有的多样性和灵活性。本教程概述了不同光子和材料平台集成背后的动机。它回顾了常见的混合和异构集成方法，并讨论了优缺点。本教程还概述了集成在光子电路中的常见光子元件。最后，展望了混合/异构光子集成电路及其应用的未来发展方向。