The triazole inhibitive film was assembled on copper surface via the click reaction between p-toluenesulfonyl azide (TA) and propiolic acid (PA) in presence of Cu₂S quantum dots (CuDs). The click-assembled film on copper surface has good anticorrosion property in 3 wt.% NaCl solution. The best protective efficiency is 93.7%. The role of CuDs for the click assembly is investigated by the spectral analysis, electrochemical measurements, and surface morphology characterization. The Cu(I) in CuDs exhibited good thermodynamic stability and catalytic activity. During the assembly process, CuDs become the new interface of the click reaction and facilitate the formation of the triazole inhibitive film on copper surface.

中文翻译：

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Cu2S量子点存在下通过点击组装在铜表面形成三唑抑制膜

在 Cu ₂ S 量子点 (CuD)存在下，通过对甲苯磺酰叠氮化物 (TA) 和丙炔酸 (PA)之间的点击反应，将三唑抑制膜组装在铜表面。铜表面的点击组装膜在3 wt.% NaCl溶液中具有良好的防腐性能。最佳防护效率为93.7%。通过光谱分析、电化学测量和表面形态表征研究了 CuDs 在点击组件中的作用。CuDs中的Cu(I)表现出良好的热力学稳定性和催化活性。在组装过程中，CuDs成为点击反应的新界面，促进了铜表面三唑抑制膜的形成。