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DC and RF analysis of vertical 3D p-type silicon nanotube FET for low power applications
International Journal of Electronics ( IF 1.1 ) Pub Date : 2021-11-29 , DOI: 10.1080/00207217.2021.1941288
Josephine Anucia. A 1 , Gracia. D 1 , Jackuline Moni D 1
Affiliation  

ABSTRACT

A vertical p-type 3D silicon nanotube field effect transistor (p-type Si-NTFET) is designed and simulated by using the tool Sentaurus Technology computer-aided design (TCAD). To improve the performance with reduced short channel effects, Si-NTFET device is created with inner and outer gate structures. The performance of the proposed device is analysed in terms of outer gate length. The vertical 3D p-type Si-NTFET gives an on state current (ION) of −2.084 × 10−3 A/µm, off state current of (IOFF) of −2.457 × 10−12A/µm and subthreshold swing of the p-type Si-NTFET device is 53 mV/dec at VDS of −0.3 V. The obtained ION/IOFF ratio of the device is 109. The capacitances (CGD, CGG) and the transconductance (gm) and cutoff frequency (ft) of the device are also analysed. The simulated p-type Si-NTFET device has proved that the device is suitable for low-power applications.



中文翻译:

用于低功率应用的垂直 3D p 型硅纳米管 FET 的 DC 和 RF 分析

摘要

使用 Sentaurus Technology 计算机辅助设计 (TCAD) 工具设计和仿真了一种垂直 p 型 3D 硅纳米管场效应晶体管(p 型 Si-NTFET)。为了提高性能并减少短沟道效应,Si-NTFET 器件被创建为具有内栅极和外栅极结构。根据外栅极长度分析了所提出器件的性能。垂直 3D p 型 Si-NTFET 的导通电流 ( I ON ) 为 -2.084 × 10 -3 A/µm,关断电流 ( I OFF ) 为 -2.457 × 10 -12 A/µm 和亚阈值摆幅p 型 Si-NTFET 器件在-0.3 V 的V DS下为 53 mV/dec。获得的I ON / I该器件的关闭比为 10 9。还分析了器件的电容 ( C GD , C GG ) 和跨导 ( g m ) 和截止频率 ( f t )。模拟的 p 型 Si-NTFET 器件证明该器件适用于低功率应用。

更新日期:2021-11-29
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